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Ming-Chi Kuo: Apple's M5 Series Chips To Adopt TSMC's N3P Process
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Ming-Chi Kuo, a reputable Apple analyst at TF International Securities, said that the iPhone 18 Pro wide-angle camera is anticipated to be upgraded to variable aperture in 2026, and the assembly equipment for the aperture blades, a key component, will be supplied by BESI.

Apple's (AAPL.US) M5 series chips will use TSMC's (TSM.US) N3P process, Kuo said, foreseeing that the M5, M5 Pro/ Max, and M5 Ultra will be mass-produced in 1H25, 2H25 and 2026, respectively.

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